SOT2174-1:

概述

HUFLGA16, thermal enhanced very very thin finepitch land grid array package, 0.4 mm pitch, 2 mm x 2 mm x 0.54 mm body

Package Version	Package Name	贴装	端子位置	封装风格	尺寸	終止計數	材料
SOT2174-1		surface mount	bottom	HUFLGA	2 x 2 x 0.54	16	plastic

生产代码	Reference Codes	Issue Date
98ASA01878D		2022-01-27