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SOT2126-1: WLCSP140
SOT2126-1: WLCSP140
概述
WLCSP140, wafer level chip-size package; 140 terminals; 0.3 mm pitch; 4.385 mm x 4.96 mm x 0.455 mm body
Package Version
Package Name
贴装
端子位置
封装风格
尺寸
終止計數
材料
SOT2126-1
WLCSP140
surface mount
bottom
WLCSP
4.96 x 4.385 x 0.455
140
plastic
生产代码
Reference Codes
Issue Date
98ASA01734D
2022-01-13