SOT1934-1: HLFLGA17

概述

HLFLGA17, thermal enhanced low profile fine-pitch land grid array package, 17 terminals, 0.65 mm pitch, 4 mm x 3 mm x 1.348 mm body

Package Version	Package Name	贴装	端子位置	封装风格	尺寸	終止計數	材料
SOT1934-1	HLFLGA17	surface mount	bottom	HLLGA	4 x 3 x 1.348	17	plastic

生产代码	Reference Codes	Issue Date
98ASA01096D		2019-02-18

产品

部分	描述	Quick access
AFLP5G25641	Airfast Pre-Driver Module, 2300-2700 MHz, 32 dB, 29 dBm	View parametrics
AFLP5G35645	Airfast Pre-Driver Module, 3400-3800 MHz, 32 dB, 29 dBm	View parametrics