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产品信息
封装
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SOT1898-1: HLQFP64
SOT1898-1: HLQFP64
概述
plastic, thermal enhanced low profile quad flat package; 64 leads; 14 x 14 x 1.5 mm body; exposed die pad
Package Version
Package Name
贴装
端子位置
封装风格
尺寸
終止計數
材料
SOT1898-1
HLQFP64
surface mount
bottom
HQFP
14 x 14 x 1.5
64
plastic
生产代码
Reference Codes
Issue Date
SOT1898
2016-09-01