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产品信息
封装
封装搜索
SOT1780-10: WLCSP36
SOT1780-10: WLCSP36
概述
WLCSP36, wafer level chip-scale package, 36 terminals, 0.4 mm pitch, 2.8 mm x 2.52 mm x 0.5 mm body (backside coating included)
Package Version
Package Name
贴装
端子位置
封装风格
尺寸
終止計數
材料
SOT1780-10
WLCSP36
surface mount
bottom
WLCSP
2.8 x 2.52 x 0.5
36
生产代码
Reference Codes
Issue Date
98ASA01327D
2018-11-01