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SOT1774-1: WLCSP120
SOT1774-1: WLCSP120
概述
WLCSP120, wafer level chip-size package; 120 terminals; 0.4 mm pitch; 5.28 mm x 5.29 mm x 0.6 mm body
Package Version
Package Name
贴装
端子位置
封装风格
尺寸
終止計數
材料
SOT1774-1
WLCSP120
surface mount
bottom
WLCSP
5.28 x 5.29 x 0.6
120
生产代码
Reference Codes
Issue Date
98ASA00311D
NON-JEDEC(JEDEC
2017-06-11