SOT1746-3: HSOP32


概述

HSOP32, plastic, thermal enhanced small outline package; 32 terminals; 0.65 mm pitch; 7.5 mm x 11 mm x 2.33 mm body
Package Version Package Name 贴装 端子位置 封装风格 尺寸 終止計數 材料
HSOP32 surface mount double HSOP 7.5 x 11 x 2.33 32 plastic
生产代码 Reference Codes Issue Date
98ASA10556D E-PDSO-G32(JEDEC 2017-06-11
部分 描述 Quick access
Switch Detection Interface, 22-switches, 3.3 V / 5.0 V SPI , SOICW-EP 32
Transceiver, DSI2, Quad, Differential, SOIC 32
System Basis Chip, LIN, 2x 5.0 V/400mA LDOs, 3/4 wakeup, SOIC 32
SBC W/HIGH SPEED CAN 5V
System Basis Chip, LIN, 2x 3.3 V/400mA LDOs, 3/4 wakeup, SOIC 32
5V SBC HSCAN SNGL LIN
System Basis Chip, 2x 3.3 V/400mA LDOs, 4 wakeup, SOIC 32
System Basis Chip, 2x 5.0 V/400mA LDOs, 4 wakeup, SOIC 32
5V SBC HSCAN SNGL LIN
System Basis Chip, 2x 3.3 V/400mA LDOs, 4 wakeup, SOIC 32
System Basis Chip, 2x 5.0 V/400mA LDOs, 4 wakeup, SOIC 32
3.3V SBC HSCAN SNGL LIN
System Basis Chip, 2x 5.0 V/400mA LDOs, 1 wakeup, SOIC 32
Switch Detection Interface, 22-switches, 3.3 V / 5.0 V SPI , SOICW-EP 32
Engine Control IC, One Cylinder, Electronic fuel injection (EFI), SOIC 32
SBC W/HIGH SPEED CAN 3V
System Basis Chip, 2x 3.3 V/400mA LDOs, 1 wakeup, SOIC 32
System Basis Chip, 2x 5.0 V/400mA LDOs, 1 wakeup, SOIC 32
Engine controller, 4 low side driver, 4 pre driver, SPI, EFI, SOIC 32
System Basis Chip, LIN, 2x 3.3 V/400mA LDOs, 3/4 wakeup, SOIC 32
System Basis Chip, LIN, 2x 5.0 V/400mA LDOs, 3/4 wakeup, SOIC 32
System Basis Chip, LIN, 2x 3.3 V/400mA LDOs, 3/4 wakeup, SOIC 32
System Basis Chip, 2x 3.3 V/400mA LDOs, 4 wakeup, SOIC 32
3.3V SBC HSCAN
System Basis Chip, 2x 5.0 V/400mA LDOs, 4 wakeup, SOIC 32
5V SBC HSCAN
Switch Detection Interface, 22-switches, 3.3 V / 5.0 V SPI , SOICW-EP 32
System Basis Chip, LIN, 2x 5.0 V/400mA LDOs, 3/4 wakeup, SOIC 32
System Basis Chip, 2x 3.3 V/400mA LDOs, 1 wakeup, SOIC 32