SOT1708-1: BGA360


概述

BGA360, plastic, ball grid array; 360 balls; 1 mm pitch; 23 mm x 23 mm x 1.9 mm body
Package Version Package Name 贴装 端子位置 封装风格 尺寸 終止計數 材料
BGA360 surface mount bottom BGA 23 x 23 x 1.9 360 plastic
生产代码 Reference Codes Issue Date
98ARE10605 2017-06-11
部分 描述 Quick access
MCF5445x 32-bit MPU, ColdFire V4 core, 200MHz, PBGA 360
MCF5445x 32-bit MPU, ColdFire V4 core, 266MHz, PBGA 360
MCF5445x 32-bit MPU, ColdFire V4 core, 266MHz, PBGA 360
MCF5445x 32-bit MPU, ColdFire V4 core, 266MHz, PBGA 360
MCF5445x 32-bit MPU, ColdFire V4 core, 200MHz, PBGA 360
MCF5445x 32-bit MPU, ColdFire V4 core, 200MHz, PBGA 360
MCF5445x 32-bit MPU, ColdFire V4 core, 266MHz, PBGA 360
MCF5445x 32-bit MPU, ColdFire V4 core, 200MHz, PBGA 360