SOT1655-5: FBGA525


概述

FBGA525, plastic, fine-pitch ball grid array package; 525 bumps; 0.8 mm pitch; 19 mm x 19 mm x 1.97 mm body
Package Version Package Name 贴装 端子位置 封装风格 尺寸 終止計數 材料
FBGA525 surface mount bottom FBGA 19 x 19 x 1.97 525 plastic
生产代码 Reference Codes Issue Date
98ASA01463D 2022-09-13
部分 描述 Quick access
S32G399A Arm Cortex-M7 and -A53, HSE, LLCE, PFE, PCIe, 20x CAN FD, 4x GbE - Vehicle Network Processor