SOT1444-13: WLCSP49

概述

WLCSP49, wafer level chip-scale package, 49 terminals, 0.4 mm pitch, 3 mm x 2.9 mm x 0.525 mm body (backside coating included)

Package Version	Package Name	贴装	端子位置	封装风格	尺寸	終止計數	材料
SOT1444-13	WLCSP49	surface mount	bottom	WLCSP	3 x 3.29 x 0.525		silicon

生产代码	Reference Codes	Issue Date
98ASA01877D		2021-12-23