SOT1443-7: WLCSP30

概述

wafer level chip-scale package; 30 bumps; 0.4 mm pitch, 2.44 mm x 2.2 mm x 0.525 mm body (backside coating included)

Package Version	Package Name	贴装	端子位置	封装风格	尺寸	終止計數	材料
SOT1443-7	WLCSP30	surface mount	bottom	WLCSP	2.44 x 2.2 x 0.525	30

生产代码	Reference Codes	Issue Date
98ASA01432D		2019-04-16