SOT1394-3: WLCSP16

概述

WLCSP16, wafer level chip-scale package, 16 bumps, 2.20 mm x 2.20 mm x 0.555 mm body (backside coating included)

Package Version	Package Name	贴装	端子位置	封装风格	尺寸	終止計數	材料
SOT1394-3	WLCSP16	surface mount	bottom	WLCSP	2.20 x 2.20 x 0.555	16

生产代码	Reference Codes	Issue Date
SOT1394		2018-03-12

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