SOT1390-8: WLCSP12

概述

WLCSP12, wafer level chip scale package; 12 bumps; 0.4 mm pitch; 1.65 mm x 1.25 mm x 0.525 mm body (backside coating included)

Package Version	Package Name	贴装	端子位置	封装风格	尺寸	終止計數	材料
SOT1390-8	WLCSP12	surface mount	bottom	WLCSP	4 x 4 x 0.5	12

生产代码	Reference Codes	Issue Date
SOT1390-8		2017-10-23

产品

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