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产品信息
封装
封装搜索
SOT1390-12: WLCSP12
SOT1390-12: WLCSP12
概述
WLCSP12, wafer level chip-size package, 12 terminals, 0.4 mm pitch, 1.62 mm x 1.19 mm x 0.56 mm body
Package Version
Package Name
贴装
端子位置
封装风格
尺寸
終止計數
材料
SOT1390-12
WLCSP12
surface mount
bottom
WLCSP
1.62 x 1.19 x 0.56
12
silicon
生产代码
Reference Codes
Issue Date
98ASA01954D
2022-07-04