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产品信息
封装
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SOT1318-1: HXQFN32
SOT1318-1: HXQFN32
概述
plastic, thermal enhanced extremely thin quad flat package; no leads; 32 terminals; 0.4 mm pitch; 4 mm x 4 mm x 0.5 mm body
Package Version
Package Name
贴装
端子位置
封装风格
尺寸
終止計數
材料
SOT1318-1
HXQFN32
surface mount
quad
HXQFN
4 x 4 x 0.5
32
plastic
生产代码
Reference Codes
Issue Date
SOT1318
2011-11-30