OL-TFA9897B: WLCSP

概述

wafer level chip-scale package; 30 bumps; 2.06 x 2.72 x 0.525 mm (backside coating included)

Package Version	Package Name	贴装	端子位置	封装风格	尺寸	終止計數	材料
OL-TFA9897B	WLCSP	surface mount	bottom	UC	2.06 x 2.72 x 0.525	30	plastic

生产代码	Reference Codes	Issue Date
OL-TFA9897B		2015-03-13