OL-NX5P3001: WLCSP

概述

wafer level chip-scale package; 12 bumps; 1.36 x 1.66 x 0.51 mm, 0.4 mm pitch (Backside coating included)

Package Version	Package Name	贴装	端子位置	封装风格	尺寸	終止計數	材料
OL-NX5P3001	WLCSP	surface mount	bottom	UC	1.36 x 1.66 x 0.51	12	plastic

生产代码	Reference Codes	Issue Date
OL-NX5P3001		2013-05-23

产品

部分	描述	Quick access
NX5P3001UK	Bidirectional High-Side Power Switch for Charger and USB‑OTG Combined Applications	View parametrics