OL-NX5P2190: WLCSP

概述

wafer level chip-scale package; 9 bumps; body 1.36 x 1.36 x 0.51 mm (Backside coating included)

Package Version	Package Name	贴装	端子位置	封装风格	尺寸	終止計數	材料
OL-NX5P2190	WLCSP	surface mount	bottom	UC	1.36 x 1.36 x 0.51	9	plastic

生产代码	Reference Codes	Issue Date
OL-NX5P2190		2014-02-14