OL-NX5P1100: WLCSP

概述

WLCSP12: wafer level chip-scale package; 12 bumps; 1.36 x 1.66 x 0.51 mm, 0.4 mm pitch (Backside coating included)

Package Version	Package Name	贴装	端子位置	封装风格	尺寸	終止計數	材料
OL-NX5P1100	WLCSP	surface mount	bottom	UC	1.66 x 1.36 x 0.51	12	other

生产代码	Reference Codes	Issue Date
WLCSP12		2013-12-20