MOTOROLA Semiconductor Products Sector Issuing Division: SPS ------------------------------------------------------------------------ PRODUCT AND PROCESS CHANGE NOTIFICATION Generic Copy ------------------------------------------------------------------------ 05-OCT-2000 Subject: MOTOROLA PRODUCT AND PROCESS CHANGE NOTIFICATION 5944 TITLE: PLCC MATERIAL CHANGE FOR 240C MSL EFFECTIVE DATE: 13-Jan-2001 AFFECTED CHANGE CATEGORIES * MOTOROLA ASSEMBLY SITE * ASSEMBLY PROCESS AFFECTED PRODUCT DIVISIONS * NETWORKING & COMMUNICATION SYSTEMS (NN) * IMAGING SYSTEMS DIV (LD) * WIRELESS COMMUNICATIONS DIV (VC) * ADVANCED VEHICLE SYS DIV (JB) * WIRELESS INFRASTRCT SYS DIV (NH * BODY ELECT, OCCUPANT SAFETY (JD * RF/IF DIV (VW) * CPD- COMPUTING PLATFORM DIVISION (NR) * MEDIA PROCESSING PLATFORM DIV (LM) * IMAGING SYSTEM DIVISION (LZ) * ENTERTAINMENT SYSTEMS DIV (LB) * DRIVER INFORMATION DIVISION (JI) * High Performance Embedded System Division (AP) * MOTOROLA MICROCONTROLLERS DIV (AC ADDITIONAL RELIABILITY DATA: Available REFERENCE: Contact Sales Office (R13489) Contact your local Motorola Sales Office. SAMPLES: Contact Local Sales Office REFERENCE: Contact Sales Office () Contact your local Motorola Sales Office. For any questions concerning this notification: REFERENCE: Contact Sales Office (TS CHONG) DISCLAIMER DISCLAIMER: MOTOROLA WILL CONSIDER THIS CHANGE APPROVED UNLESS SPECIFIC CONDITIONS OF ACCEPTANCE ARE PROVIDED IN WRITING WITHIN 30 DAYS OF RECEIPT OF THIS NOTICE. TO DO SO, CONTACT YOUR LOCAL MOTOROLA SALES OFFICE. DESCRIPTION AND PURPOSE Background: Advancements in packaging materials provides the opportunity to improve manufacturing capabilities and plastic package integrity. Motorola has made the commitment to continuously improve our technologies to support internal manufacturing and customer satisfaction goals.As a result of this commitment, Motorola is pleased to announce the qualification of packaging materials in all PLCC packages which will meet current Moisture Sensitivity Level (MSL) performance at 240C. The qualification of Sumitomo's CRM 1064 Die Attach and Nitto's MP8000CH4 Mold Compound for PLCCs was previously announced in 1998 by GPCN #s: 3523 and 3524. This PCN extends that qualification to include the latest gold wire technology with higher modulus for better fine pitch wire bonding capability and to all PLCC packages. The MP8000 series, an Ortho-Cresol-Novolac ( OCN) epoxy mold epoxy compound, was introduced by Nitto in 1996 to replace their older silicon low stress OCN mold compounds used in the PLCC and other package families. MP8000 is a major product line for Nitto and it is being used for high volume production in Motorola as well as by other major semiconductor suppliers and contract assembly factories. Sumitomo's CRM1064MB Die Attach is their latest Phenol-Novolac based, silver filled epoxy. The addition of a proprietary stress additive and coupling agent provides improved stress and adhesive performance as compared with CRM1033 and CRM1078 which are currently used in the PLCC assemblies. Higher modulus gold wire is now widely used in assembly of semiconductors and is being used for volume production at Motorola factories. The wire modulus is changed by adjusting the dopants in the wire, however, there is no impact on the gold content or performance. This "stiffer" wire provides a solution for finer pad/die geometries by enabling the reduction of wire diameter and it also controls wire sweep. (Note: Wire diameter will not be changed for the products included in this PCN.) PRODUCT CHANGE: MATERIAL FROM TO -------- ------- --------- Die Attach Epoxy CRM1033B and CRM1064MB CRM1078 Gold Wire Type C, FA, M3 High Modulus (Sumitomo NL3 or equivalent) Mold Compound CEL7700LC and MP8000CH4 MP180HB COINCIDENT WITH THE MATERIAL CHANGES, THE MSL REFLOW TEMPERATURE WILL BE REVISED FROM 220 C PEAK REFLOW TO 240 C PEAK. MSL CLASS (i.e. 1, 2, 3, etc.) WILL REMAIN AT THE SAME LEVEL OR BETTER. PRODUCT AFFECTED: The new die attach adhesive, mold compound and gold wire will be used on the listed products which are assembled in PLCC packages at Motorola Japan (SDI) and Motorola Malaysia (KLM). EXCEPTIONS: Discontinued Product: Devices previously announced as a product discontinuance, continue to be "end of life" product, and the effective dates remain as listed in the original discontinuance notification. FSRAM devices requiring low-alpha mold compound and V-series devices in PLCC will not change. PLCC52Ld FSRAM: 99SF36FA6FN 99SF36FA6FN10 99SF36FA6FN12 99SF36FA6FN15 99SF36FB6FN 99SF36FB6FN10 99SF36FB6FN12 99SF36FB6FN9 99SF36FC6FN5 99SF36FC6FN7 99SF36FH6FN9 99SF36FM6FN 99SF36FM6FN10 99SF36FM6FN12 99SF36FM6FN9 PLCC68Ld V-series Prodline: SAQ05V7 SB05V7FN SC407125CFN SC407146CFN SC407103CFNR2 SC407125CFNR2 SC407146CFNR2 SC407111CFNR2 SC407126CFN SC407147CFN SC407112CFNR2 SC407126CFNR2 SC407147CFNR2 SC407113CFNR2 SC407129CFNR2 SC407148CFN SC407115CFNR2 SC407130CFN SC407148CFNR2 SC407116CFN SC407130CFNR2 SC407149CFN SC407116CFNR2 SC407132CFN SC407149CFNR2 SC407118CFNR2 SC407132CFNR2 SC407151CFN SC407119CFNR2 SC407133CFN SC407151CFNR2 SC407120CFNR2 SC407133CFNR2 SC407152CFN SC407121CFN SC407135CFNR2 SC407152CFNR2 SC407121CFNR2 SC407139CFN SC407154CFN SC407122CFN SC407139CFNR2 SC407154CFNR2 SC407122CFNR2 SC407143CFN SC407156CFN SC407123CFNR2 SC407143CFNR2 SC407156CFNR2 SC407124CFN SC407144CFN SC407157CFN SC407124CFNR2 SC407144CFNR2 SC407157CFNR2 XC407155CFN 98SC407124CFNR2 XC407155CFNR2 98SC407146CFNR2 XC407158CFN XC407158CFNR2 XC407160CFN XC407160CFNR2 XC407162CFN XC407162CFNR2 XC407165CFN XC407165CFNR2 XC68HC05V7CFN XC68HC05V7FN ZC407161CFN ZC407161CFNR2 ZC407164CFN ZC407164CFNR2 ZC407165CFNR2 98SC407103CFNR2 PLCC68Ld V-series Prodline: SAQ05V12 MC68HC05V12FN PC68HC05V12CFN SC443704CFN SC443706CFN SC443706CFNR2 SC443708CFN SC443708CFNR2 SC443713CFNB SC443713CFNBR2 XC443709CFN XC443709CFNR2 XC443710CFN XC443710CFNR2 XC443711CFN XC443711CFNR2 XC443712CFN XC443712CFNR2 97SC443708CFNR2 PLCC68Ld V-series Prodline: SAQ75V8 SC416104CFN XC525150CFNR2 SC416104CFNR2 XC525220CFN SC416105CFN XC525220CFNR2 SC416105CFNR2 XC528664CFN SC416224CFN XC528664CFNR2 SC416224CFNR2 XC528671CFN SC416228CFN XC528671CFNR2 SC416228CFNR2 XC528695CFN SC416229CFN XC528695CFNR2 SC416229CFNR2 XC68HC705V8CFN SC525044CFN XC68HC705V8FN SC525044CFNR2 XC68HC705V8PCFN SC525085CFN XC68HC705V8XPCFN SC525085CFNR2 97SC525085CFNR2 SPAKHC705V8CFN 97XC68HC705V8CFN SPAKHC705V8FN SPAKHC705V8FS XC525150CFN PCN IMPLEMENTATION: Customers are not required to re-qualify the devices. Devices using the new materials will be available upon expiration of this PCN. The transition period for the new materials will result in a mixture of products with old and new materials being shipped to the customer for an undetermined period of time. QUALIFICATION PLAN Same as Reliability Data RELIABILITY DATA SUMMARY (NOTE: Detailed reliability reports are available upon request.) TEST VEHICLES: Motorola Malaysia (KLM) PACK.,LD, Device Die Size, Epoxy, Wire, Mold Cpd PLCC,28,XC68HC56FN,188 x 171,CRM1064MB,Sumitomo NL3,MP8000CH4 PLCC,44,MC68HC11DOFN,248 x 212,CRM1064MB,Sumitomo NL3, MP8000CH4 PLCC,44,68HC05TB (7G54K),73 x 202, CRM1064MB,Sumitomo NL3, MP8000CH4 PLCC,52,MC68HC711E20CFN2,432 x 418,CRM1064MB,Sumitomo NL3, MP8000CH4 PLCC,52,68HC908AS60(3J74Y),308 X 296,CRM1064MB,Sumitomo NL3, MP8000CH4 PLCC,52,68HC908AS60(8H62A),314 X 297,CRM1064MB,Sumitomo NL3, MP8000CH4 PLCC,68,SC439135CFN1R2,352 x 284,CRM1064MB,Sumitomo NL3, MP8000CH4 PLCC,68,MC68882FN16A,237 x 163,CRM1064MB,Sumitomo NL3,MP8000CH4 NOTE: all data are in units failed/units tested A. HIGH TEMP OP. LIFE (HTOL); 480 HRS AT 150C OR 504 HRS AT 140C OR 1008 HRS AT 125C -FULL QUAL(408 HRS @ 150C): 0/1077 B. High Temp Bake (HTB); 1000 HRS. @ 150c -FULL QUAL(1000 HRS AT 150C): 0/464 C. PRE-CONDITIONING AND HAST; PC PER JA 112 AND J113, HAST PER JESD22A110B. PC IS DONE AT 240C PEAK REFLOW TEMP. PER MOTOROLA SPEC. -PC LEVEL: MSL 1 - PLCC 28 TO 44 LD. MSL 3 - PLCC 52 TO 68 LD. -FULL HAST (96 HRS): 0/1154 D. PRE-CONDITIONING AND AUTOCLAVE; PC PER JA 112 AND J113, AC PER JA102. PC IS DONE AT 240C PEAK REFLOW TEMP. PER MOTOROLA SPEC. -PC LEVEL: MSL 1 - PLCC 28 TO 44 LD. MSL 3 - PLCC 52 TO 68 LD. MSL 3 - PLCC 52 TO 68 LD. -FULL AC (96 HRS): 0/1489 E. PRE-CONDITIONING AND TEMP CYCLE; PC PER JA 112 AND J113, AC PER JA104. PC IS DONE AT 240C PEAK REFLOW TEMP. PER MOTOROLA SPEC. -PC LEVEL: MSL 1 - PLCC 28 TO 44 LD. MSL 3 - PLCC 52 TO 68 LD. - FULL TC (500 cycles): 0/1507 F. E2PROM DATA ENDURANCE AND RETENTION TEST WHERE REQUIRED PER AEC-Q100-005 -RESULTS: 0/231 G. Early Life Failure Rate (ELFR) per JA108 -RESULTS: 0/15194 H. Gate Leakage Test per AEC-Q100-006 -RESULTS: 0/12 I. ELECTRICAL DISTRIBUTION -RESULTS: Pass (Detail distribution data available upon request) J. MANUFACTURABILITY(Die Shear, Ball Shear, Wire Pull, Package Warpage, Package Offset, Resin Bleed, Wire Sweep, Internal Voids, Microgaps, Lead Coplanarity, External Visual, Physical Dimensions, Lead Fatigue, Solderability). -RESULTS: Pass (Detail Cpk data available upon request) Motorola Japan (SDI) PACK., LD, Device, Die Size, Epoxy, Wire,Mold Cpd PLCC, 44, HC705C9A, 189 x 155, CRM1064MB, Sumitomo NL3, MP8000CH4 PLCC, 52, MC68HC705B5VFN,178 x 244,CRM1064MB, Sumitomo NL3, MP8000CH4 PLCC,52,HC11E20,194 x 313,CRM1064MB, Sumitomo NL3, MP8000CH4 PLCC, 52, HC11E9,193 x 246, CRM1064MB, Sumitomo NL3, MP8000CH4 NOTE: all data are in units failed/units tested A. HIGH TEMP OP. LIFE (HTOL); 480 HRS AT 150C OR 504 HRS AT 140C OR 1008 HRS AT 125C -INTERIM QUAL (168 HRS @ 140C): 0/231 -FULL QUAL(408 HRS @ 150C OR 1008 HRS @ 125C): 0/231 B. High Temp Bake (HTB); 1000 HRS. @ 150c -INTERIM QUAL (168 HRS @ 175C): 0/154 -FULL QUAL(1000 HRS AT 150C OR 504 HRS AT 150C): 0/308 C. PRE-CONDITIONING AND HAST; PC PER JA 112 AND J113, HAST PER JESD22A110B. PC IS DONE AT 240C PEAK REFLOW TEMP. PER MOTOROLA SPEC. -PC LEVEL: MSL 2 - PLCC 44 TO 68 LD. -INTERIM HAST (48 HRS): 0/154 -FULL HAST (96 HRS): 0/231 D. PRE-CONDITIONING AND AUTOCLAVE; PC PER JA 112 AND J113, AC PER JA102. PC IS DONE AT 240C PEAK REFLOW TEMP. PER MOTOROLA SPEC. -PC LEVEL: MSL 2 - PLCC 44 TO 68 LD. -FULL AC (96 HRS): 0/462 E. PRE-CONDITIONING AND TEMP CYCLE; PC PER JA 112 AND J113, AC PER JA104. PC IS DONE AT 240C PEAK REFLOW TEMP. PER MOTOROLA SPEC. -PC LEVEL: MSL 2 - PLCC 44 TO 68 LD. -FULL TC (500 cycles): 0/462 F. E2PROM DATA ENDURANCE AND RETENTION TEST WHERE REQUIRED PER AEC-Q100-005 -RESULTS: NOT APPLICABLE G. Early Life Failure Rate (ELFR) per JA108 -FULL ELFR (125C; 48 HRS): 0/2400 H. Gate Leakage Test per AEC-Q100-006 -RESULTS: 0/18 I. ELECTRICAL DISTRIBUTION -RESULTS: Pass (Detail distribution data available upon request) J. MANUFACTURABILITY(Die Shear, Ball Shear, Wire Pull, Package Warpage, Package Offset, Resin Bleed, Wire Sweep, Internal Voids, Microgaps, Lead Coplanarity, External Visual, Physical Dimensions, Lead Fatigue, Solderability). -RESULTS: Pass (Detail Cpk data available upon request) ELECTRICAL CHARACTERISTIC SUMMARY No changes to electrical test parameters. CHANGED PART IDENTIFICATION None. The device part number and marking will not change. Standard material, product and process traceability rules will apply ------------------------------------------------------------------------ RELATED NOTIFICATIONS: SOIC MATERIAL CHANGE FOR 240C MSL SOIC MATERIAL CHANGE FOR 240C MSL SOIC MATERIAL CHANGE FOR 240C MSL SOIC MATERIAL CHANGE FOR 240C MSL SOIC MATERIAL CHANGE FOR 240C MSL AFFECTED DEVICE LIST PART KMC11D0CFN3 KMC11F1CFN3 KMC11F1CFN4 KMC11F1CFN5 KMC68L11D0FN2 KMC68S711E9CFN2 KMC705C8ACFN KMC705C9ACFN KMC711D3CFN3 KMC711D3MFN3 KMC711E20CFN3 KMC711E20CFN4 KMC711E20MFN3 KMC711E9CFN3 KMC711E9CFN4 KMC811E2CFN2 KMC811E2MFN2 KMCL11F1CFN3 KXC705D32ACFN LSC408210CFN LSC427332FN MC145001FN MC145453FN MC145453FNR2 MC2681FN MC2681FNR2 MC33120FN MC33120FNR2 MC33121FN MC33121FNR2 MC34010FN MC34010FNR2 MC68681FN MC68681FNR2 MC68711E9CFN2R2 MC68882CFN16A MC68882CFN20A MC68882CFN25A MC68882CFN33A MC68882FN16A MC68882FN16AR2 MC68882FN20A MC68882FN20AR2 MC68882FN25A MC68882FN25AR2 MC68882FN33A MC68882FN33AR2 MC68882FN40A MC68882FNA3 MC68901FN MC68EC000FN10 MC68EC000FN10R2 MC68EC000FN12 MC68EC000FN12R2 MC68EC000FN16 MC68EC000FN16R2 MC68EC000FN20 MC68EC000FN20R2 MC68EC000FN8 MC68EC000FN8R2 MC68HC000CFN MC68HC000CFN10 MC68HC000CFN10R2 MC68HC000CFN12 MC68HC000CFN16 MC68HC000CFN8 MC68HC000FN10 MC68HC000FN10R2 MC68HC000FN12 MC68HC000FN12R2 MC68HC000FN16 MC68HC000FN16R2 MC68HC000FN20 MC68HC000FN20R2 MC68HC000FN8 MC68HC000FN8R2 MC68HC000FNB MC68HC000IFN12 MC68HC000IFN12R2 MC68HC000IFN16 MC68HC000IFN16R2 PART MC68HC000IFN8 MC68HC000IFN8R2 MC68HC001CFN10 MC68HC001CFN10R2 MC68HC001CFN8 MC68HC001CFN8R2 MC68HC001FN10 MC68HC001FN10R2 MC68HC001FN12 MC68HC001FN16 MC68HC001FN16R2 MC68HC001FN8 MC68HC001FN8R2 MC68HC05C0FN MC68HC05C8GCFN MC68HC05C8GFN MC68HC05C9ACFN MC68HC05C9AFN MC68HC05C9AMFN MC68HC05C9CFN MC68HC05C9FN MC68HC11A0CFN3 MC68HC11A0CFN3R2 MC68HC11A0FN MC68HC11A0FN3 MC68HC11A0FNR2 MC68HC11A1CFN3 MC68HC11A1CFN3R2 MC68HC11A1FN MC68HC11A1FN3 MC68HC11A1FNR2 MC68HC11A1MFN MC68HC11A1VFN MC68HC11A1VFNR2 MC68HC11A8FN MC68HC11A8FN1 MC68HC11A8FN1R2 MC68HC11D0CFN2 MC68HC11D0CFN2R2 MC68HC11D0CFN3 MC68HC11D0CFN3R2 MC68HC11D0FN MC68HC11D0FNR2 MC68HC11D3FN MC68HC11ED0CFN2 MC68HC11ED0CFN3 MC68HC11F1CFN2 MC68HC11F1CFN3 MC68HC11F1CFN3R2 MC68HC11F1CFN4 MC68HC11F1CFN4R2 MC68HC11F1CFN5 MC68HC11F1FN MC68HC11F1FN4 MC68HC11F1FN4R2 MC68HC11F1FNR2 MC68HC11F1MFN4 MC68HC11F1VFN2 MC68HC11F1VFN3 MC68HC11F1VFN4 MC68HC11F1VFNR2 MC68HC11G5FN1 MC68HC11L0CFN2 MC68HC11L1CFN2 MC68HC11PH8CFN4 MC68HC705B16CFN MC68HC705B16FN MC68HC705B16MFN MC68HC705B16NCFN MC68HC705B16NFN MC68HC705B16NMFN MC68HC705B16NVFN MC68HC705B16VFN MC68HC705B5CFN MC68HC705B5FN MC68HC705B5FNF MC68HC705B5VFN MC68HC705C4ACFN MC68HC705C4AVFN MC68HC705C8ACFN MC68HC705C8AFN PART MC68HC705C8AVFN MC68HC705C8CFN MC68HC705C9ACFN MC68HC705C9AFN MC68HC705CT4FN MC68HC711D3CFN2 MC68HC711D3CFN3 MC68HC711D3MFN2 MC68HC711D3VFN2 MC68HC711D3VFN3 MC68HC711E20CFN2 MC68HC711E20CFN3 MC68HC711E20CFN4 MC68HC711E20MFN2 MC68HC711E20MFN3 MC68HC711E20VFN2 MC68HC711E9CFN MC68HC711E9CFN2 MC68HC711E9CFN3 MC68HC711E9CFN4 MC68HC711E9CFNW MC68HC711E9FN2 MC68HC711E9MFN2 MC68HC711E9VFN2 MC68HC711L6CFN2 MC68HC711L6MFN2 MC68HC711L6VFN2 MC68HC811E2CFN MC68HC811E2CFN2 MC68HC811E2FN MC68HC811E2FNR2 MC68HC811E2MFN MC68HC811E2MFN2 MC68HC811E2VFN2 MC68HCP11A0CFN3 MC68HCP11A0FN MC68HCP11A0FNR2 MC68HCP11A0VFN MC68HCP11A0VFNR2 MC68HCP11A1CFN3 MC68HCP11A1FN MC68HCP11A1FNR2 MC68HCP11A1VFN MC68HCP11A1VFNR2 MC68HSC05C8GCFN MC68HSC05C8GFN MC68HSC705C4ACFN MC68HSC705C8ACFN MC68HSC705C9AFN MC68L11A0FN2 MC68L11A1FN2 MC68L11A1FN2R2 MC68L11D0FN2 MC68L11F1CFN3 MC68L11F1FN3 MC68L711E9FN2 MC68LNC705C9ACFN MC68S711E9CFN2 MC68SEC811E2FN MC68SEC811E2FNR2 MC705C8ACFNR2 PC68HC711PH8CFN4 SB11D3FN.73 SC400690CFN2R2 SC402679CFNG SC407805VFN SC409161FN SC409265FN SC409265FNR2 SC410508CFNG SC413072FN2 SC413072FN2R2 SC413077CFN3 SC413077CFN3R2 SC413083CFN3R2 SC413086CFN3 SC413088CFN SC414103FN12R2 SC414256FN12R2 SC414292IFN16 SC414292IFN16R2 PART SC414320FN16 SC414320FN16R2 SC414330FN16 SC414392FN16R2 SC415039CFN4 SC427206FN SC427207FN SC427534CFN SC427583CFN SC427583CFNR2 SC427585CFN SC427585CFNR2 SC427586CFN SC427586CFNR2 SC439229VFN3 SC439356FN3 SC439502FN2 SC439502FN2R2 SC439724CFNW SC525160CFN SC525160CFNR2 SC525202VFN2R2 SC528701CFN SC528702CFN SC528702FN SC528702VFN SPAK68882CFN16A SPAK68882CFN20A SPAK68882CFN25A SPAK68882CFN33A SPAK68882FN16A SPAK68882FN20A SPAK68882FN25A SPAK68882FN33A SPAK68882FN40A SPAKEC000FN10 SPAKEC000FN12 SPAKEC000FN16 SPAKEC000FN20 SPAKEC000FN8 SPAKHC000FN10 SPAKHC000FN12 SPAKHC000FN16 SPAKHC000FN20 SPAKHC000FN8 SPAKHC001FN10 SPAKHC001FN16 SPAKHC705C8ACFN SPAKHC705C9ACFN SPAKHC705D32ACFN TY38447FN TY38449FN TY38469FN TY38471FN TY38476FN XC68HC05C0CFN XC68HC705B5FN XC68HC705BE12FN XC68HC705C5CFN XC68HC705C8ACFN XC68HC705C9ACFN XC68HC705C9CFN XC68HC705C9FN XC68HC705D32ACFN XC68HC705H12CFN XC68HC705H12FN XC68HC711E20CFN XC68HC711E20FN XC68HC711EA9CFN XC68HC711L6CFN2 XC68HC711PH8FN2 XC68HC811E2FN XC68HSC705C9AFN XC68HSC705D32CFN XY38464FN ZC400714VFNR2 ZC407590VFN