FSL Logo
PRODUCT AND PROCESS CHANGE NOTIFICATION
Generic Copy
ISSUE DATE:10-Jun-2014
NOTIFICATION:16151
TITLE:PRIMARY WAFER SITE TRANSFER to TSMC14 and ATMC COPPER WIRE QUALIFICATION for SPC567x 324/416/516PBGA
EFFECTIVE DATE:08-Sep-2014

DEVICE(S)
MPN
SPC5673FF3MVR2
SPC5673FF3MVR2R
SPC5673FF3MVR3
SPC5673FF3MVV2
SPC5673FF3MVV2R
SPC5673FF3MVY2
SPC5674FF3MVR3
SPC5674FF3MVR3R
SPC5674FF3MVV3
SPC5674FF3MVV3R
SPC5674FF3MVY3
SPC5674FF3MVY3R
SPC5674FF3MVZ2
SPC5674FK0MVR3
SPC5674FK0MVR3R
SPC5674FK0MVV3
SPC5674FK0MVV3R
SPC5674FK0MVY3
SPC5674FK0MVY3R

AFFECTED CHANGE CATEGORIES
  • BILL OF MATERIAL CHANGE (SAME ASSEMBLY SITE)

  • FAB SITE


    • DESCRIPTION OF CHANGE

    To meet the increasing demand for the SPC567x family of products Freescale is announcing the introduction of Taiwan Semiconductor Manufacturing Company Fab 14 (TSMC14), Tainan, Taiwan as primary wafer manufacturing location for this family.  TSMC14 has been qualified with Copper wirebond material. 

    Approval of GPCN and backlog conversion to TSMC14 is required in order to allow deliveries by the first week of December. 

    Key Dates
    Pre Alert Issued   12-Mar-14
    Approval 180 Days 8-Sep-14
    Backlog Conversion 45 Days 23-Oct-14
    TSMC14 Deliveries 45 Days 7-Dec-14

     If customer is unable to approve TSMC14 per the table above, allocation of ATMC material will begin first week of December.

    To standardize and aid manufacturing flexibility, a change from Gold to Copper Wire has been qualified for Austin Technology Manufacturing Center (ATMC), Austin, USA sourced material.  

    The change to Cu wire also includes a change in wire diameter as per the table below.

    WAFER FAB
    ASSEMBLY SITES
    PACKAGE TYPE
    CURRENT WIRE
    NEW WIRE
    		 Current Mold Compound New Mold Compound
    TSMC 14
    FSL-KLM-FM
    324/416/516PBGA
    N/A
    PdCu 20um
    		 N/A SUMITOMO G770SFL
    FSL-ATMC
    FSL-KLM-FM
    324/416/516PBGA
    Au 23um
    PdCu 20um
    		 SUMITOMO G770SFL No Change
     
     



    REASON FOR CHANGE

    The primary wafer manufacturing site transfer to TSMC14 will improve Freescale’s ability to meet increasing customer demand, while still maintaining the ability to provide backup supply from the original Fab (ATMC) in case of emergency or demand surges.

     
    The transfer from Gold to Copper wire is required to standardize manufacturing flows and mitigate against raw material cost increases.



    ANTICIPATED IMPACT OF PRODUCT CHANGE(FORM, FIT, FUNCTION, OR RELIABILITY)

    There is no impact to form, fit, function or reliability. Reliability is equivalent or improved.



    According to JEDEC Standard JESD46, lack of acknowledgement of this PCN within 30 days will be considered acceptance of change. To request further data or inquire about the notification, please enter a Service Request.

    For sample inquiries - please go to www.freescale.com

    QUAL DATA AVAILABILITY DATE:     14-Mar-2014

    QUALIFICATION STATUS:     COMPLETED

    QUALIFICATION PLAN:

    Freescale Transfer of Qualified Processes specification for Fab and Assembly Qualifications were followed.



    RELIABILITY DATA SUMMARY:

    See attached qualification results.



    ELECTRICAL CHARACTERISTIC SUMMARY:

    No change was made to the operating performance of the device. No change to datasheet. Electrical Distribution enclosed.   EMC reports available upon request.



    CHANGED PART IDENTIFICATION:

    The Tracecode marking on the device includes assembly site and datecode. Freescale will have Copper wire traceability by assembly site and datecode.

    Table below provides sample part numbers:  

    Cu Sample Part Number
    Package
    Fab
    KPC5671LK0VVZ1R
    PBGAPGE 324 23SQ1.25P1.0
    TSMC14
    KPC5673LK0VVZ2R
    PBGAPGE 324 23SQ1.25P1.0
    TSMC14
    KPC5674FK0MVR3
    TEPBGA 416 27*27*1.25 P1
    TSMC14
    KPC5674FK0MVR3R
    TEPBGA 416 27*27*1.25 P1
    TSMC14
    KPC5674FK0MVY3
    TEPBGA PGE 516 27*27 P1
    TSMC14
    KPC5674FK0MVY3R
    TEPBGA PGE 516 27*27 P1
    TSMC14
    KPC5674FK0MVV3
    TEPBGA PGE 516 27*27 P1
    TSMC14
    KPC5674FK0MVV3R
    TEPBGA PGE 516 27*27 P1
    TSMC14
    KPC5671LF3VVZ1R
    PBGAPGE 324 23SQ1.25P1.0
    ATMC
    KPC5673LF3VVZ2R
    PBGAPGE 324 23SQ1.25P1.0
    ATMC
    KPC5674FF3MVR3
    TEPBGA 416 27*27*1.25 P1
    ATMC
    KPC5674FF3MVR3R
    TEPBGA 416 27*27*1.25 P1
    ATMC
    KPC5674FF3MVY3
    TEPBGA PGE 516 27*27 P1
    ATMC
    KPC5674FF3MVY3R
    TEPBGA PGE 516 27*27 P1
    ATMC
    KPC5674FF3MVV3
    TEPBGA PGE 516 27*27 P1
    ATMC
    KPC5674FF3MVV3R
    TEPBGA PGE 516 27*27 P1
    ATMC
     



    SAMPLE AVAILABILITY DATE: 06-Jun-2014


    ATTACHMENT(S):
    External attachment(s) FOR this notification can be viewed AT:
    16151_PCN16151_Mamba_TSMC14_Transfer_&_Cu_Conv_Official_Qual_Results.pdf
    16151_PCN16151_Mamba_N31E_516PBGA_TSMC_Cu_Vs_ATMC_Au_Electrical_Distribution_Report.pdf
    16151_PCN16151_Mamba_516_ATMC_Cu_Vs_Au_Electrical_Distribution_Report.pdf
    16151_16151_Mamba_ATMC_Cu_Conv_Official_Qual_Results.pdf