部分 | 封装 | 物质声明 | 安全保障/功能安全 | 湿度灵敏度等级(MSL) | Peak Package Body Temperature(PPT)(℃) | Maximum Time at Peak Temperature(s) | |||
---|---|---|---|---|---|---|---|---|---|
无铅焊接 | 铅焊接 | 无铅焊接 | 铅焊接 | 无铅焊接 | |||||
MK52DN512ZCMD10 封装 : LBGA144 |
MK52DN512ZCMD10 (935314672557) |
No | 3 | - | 260 | - | 40 | ||
MK52DN512ZCLQ10 封装 : LQFP144 |
MK52DN512ZCLQ10 (935319841557) |
No | 3 | - | 260 | - | 40 | ||
MK52DN512CMD10 封装 : LBGA144 |
MK52DN512CMD10 (935317929557) |
No | 3 | - | 260 | - | 40 | ||
MK52DN512CLQ10 封装 : LQFP144 |
MK52DN512CLQ10 (935319948557) |
No | 3 | - | 260 | - | 40 | ||
MK50DX256ZCLQ10 封装 : LQFP144 |
MK50DX256ZCLQ10 (935317622557) |
No | 3 | - | 260 | - | 40 | ||
MK50DX256ZCLL10 封装 : LQFP100 |
MK50DX256ZCLL10 (935317589557) |
No | 3 | - | 260 | - | 40 | ||
MK50DX256CMD10 封装 : LBGA144 |
MK50DX256CMD10 (935315017557) |
No | 3 | - | 260 | - | 40 | ||
MK50DX256CMC10 封装 : LFBGA121 |
MK50DX256CMC10 (935321901557) |
No | 3 | - | 260 | - | 40 | ||
MK50DX256CLL10 封装 : LQFP100 |
MK50DX256CLL10 (935323312557) |
No | 3 | - | 260 | - | 40 | ||
MK50DX256CLK10 封装 : LQFP80 |
MK50DX256CLK10 (935323311557) |
No | 3 | - | 260 | - | 40 | ||
MK50DN512ZCLQ10 封装 : LQFP144 |
MK50DN512ZCLQ10 (935317607557) |
No | 3 | - | 260 | - | 40 | ||
MK50DN512ZCLL10 封装 : LQFP100 |
MK50DN512ZCLL10 (935324495557) |
No | 3 | - | 260 | - | 40 | ||
MK50DN512CMD10 封装 : LBGA144 |
MK50DN512CMD10 (935317965557) |
No | 3 | - | 260 | - | 40 | ||
MK50DN512CMD10R (935317965518) |
No | 3 | - | 260 | - | 40 | |||
MK50DN512CMC10 封装 : LFBGA121 |
MK50DN512CMC10 (935315045557) |
No | 3 | - | 260 | - | 40 | ||
MK50DN512CLQ10 封装 : LQFP144 |
MK50DN512CLQ10 (935324578557) |
No | 3 | 260 | 260 | 40 | 40 | ||
MK50DN512CLL10 封装 : LQFP100 |
MK50DN512CLL10 (935324576557) |
No | 3 | - | 260 | - | 40 |